china's new digital currency Top

By 11:30, 100 stocks in the two cities had daily limit.CICC and others set up a venture capital partnership in Xiamen. According to the enterprise search APP, Zhongjin Qiyuan Phase II (Xiamen) Venture Capital Partnership (Limited Partnership) was recently established with a capital contribution of 400 million yuan. Its business scope includes: engaging in equity investment, investment management, asset management and other activities with private equity funds. Enterprise investigation shows that the company is jointly held by CICC Capital Operation Co., Ltd., a wholly-owned subsidiary of CICC.Shanghai Headquarters of the Central Bank: The amount of cross-border RMB settlement in Shanghai in November was 2,491.8 billion yuan. According to the news of Shanghai Headquarters of the Central Bank, as of the end of November, there were 102 banks in Shanghai that submitted information on cross-border RMB settlement business, with a settlement amount of 2,491.8 billion yuan in November and a cumulative settlement amount of 27,151.9 billion yuan from January to November.

With a case value of 6.891 billion yuan, the Anti-smuggling Bureau of Huangpu Customs launched a special campaign to crack down on smuggling and fraudulent tax refund, which was announced by the Customs. Recently, the Anti-smuggling Bureau of Huangpu Customs, together with the Third Branch of the Securities Crime Investigation Bureau of the Ministry of Public Security, the Economic Investigation Corps of the Hunan Provincial Public Security Department and the Yueyang Public Security Bureau of Hunan Province, launched a special campaign to crack down on smuggling and fraudulent tax refund, and simultaneously carried out arrests and investigations in Dongguan, Shenzhen, Guangzhou, Yueyang and Jinjiang. After preliminary investigation, criminal gangs were suspected of smuggling imported LCD screens and integrated circuits with a case value of 756 million yuan, falsely issuing special invoices for value-added tax and defrauding export tax rebate of 6.135 billion yuan, with a total case value of 6.891 billion yuan.Mei Ansen signed a strategic cooperation agreement with Shuguang Network Technology Co., Ltd. According to Mei Ansen, recently, Mei Ansen and Shuguang Network Technology Co., Ltd. held a strategic cooperation signing ceremony in Chongqing. The two sides reached a strategic cooperation to jointly build smart mine bases and comprehensive solutions. Shuguang Network Technology Co., Ltd. is a holding subsidiary of Zhongke Shuguang (603019).Personal pension is fully implemented. The first batch of 85 equity index funds are included in the investment scope. The personal pension system will be extended to the whole country on December 15, and product expansion has also become the focus. Today, the CSRC has included the first batch of 85 equity index funds in the catalogue of personal pension investment products, including 78 products that track various broad-based indexes and 7 products that track dividend indexes, including ordinary index funds, index enhancement funds and ETF-linked funds such as Shanghai and Shenzhen 300 Index, CSI A500 Index and Growth Enterprise Market Index. The investment style of index funds is clear and the rate level is low, so the inclusion of related products is conducive to enriching investors' choices. Related products also implement preferential rates to actively benefit investors.

OPENAI API、CHATGPT、SORA流量基本恢复。Indian Rupee's exchange rate against the US dollar fell below 84.86, a record low.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)